March 26, 2013
March 26 — Hot Chips 25, a symposium on high-performance chips is making a last minute call for presentations to their Silicon Valley, California event taking place in August, 2013.
AREAS OF INTEREST
General Purpose Processor Chips
Mobile and Embedded Devices
Communications and Networking
Software for multi-Core and Heterogeneous Systems
High Integrity Computation
AUTHOR INFORMATION AND FORMAT
Presentations at HOT CHIPS are in the form of 30-minute talks in PowerPoint or .PDF. Presentation slides will be published in the HOT CHIPS Proceedings. Participants are not required to submit written papers, but a select group will be invited to submit a paper for inclusion in a special issue of IEEE Micro.
Poster submissions are also accepted from both industry and academia, and consist of 4 slides with a one-page summary. In particular, student posters describing applied research performed at a university are encouraged. The most outstanding student poster will receive a Best Poster Award.
Submissions must specify "Presentation", "Poster" or "Student Poster." Regular Presentations consist of a title, extended abstract (two pages maximum) and the presenter's contact information (name, affiliation, job title, address, phone(s), fax, and email). Please indicate whether you have submitted, intend to submit, or have already presented or published a similar or overlapping submission to another conference or journal. Also indicate if you would like the submission to be held confidential. If so indicated, these submissions remain confidential until the first day of the conference.
Submissions are evaluated by the Program Committee on the basis of performance of the device(s), degree of innovation, use of advanced technology, potential market significance, and anticipated interest to the audience.
Research and software contributions will be evaluated with similar criteria. To the extent that you are describing a product, indicate its status - design, development, tape out, silicon, shipping, etc.
Submit extended abstracts in plain text or .PDF, which may contain figures, with a minimum 10-point font to: https://www.softconf.com/c/hotchips25/
Authors will be notified of acceptance decisions by May 1, 2013.
Sponsored by the Technical Committee on Microprocessors and Microcomputers of the IEEE Computer Society, technically co-sponsored by the Solid State Circuits Society and In Cooperation with the Association of Computing Machinery, SIGARCH.
Program Committee Co-Chairs:
Source: Hot Chips
10/30/2013 | Cray, DDN, Mellanox, NetApp, ScaleMP, Supermicro, Xyratex | Creating data is easy… the challenge is getting it to the right place to make use of it. This paper discusses fresh solutions that can directly increase I/O efficiency, and the applications of these solutions to current, and new technology infrastructures.
10/01/2013 | IBM | A new trend is developing in the HPC space that is also affecting enterprise computing productivity with the arrival of “ultra-dense” hyper-scale servers.
Ken Claffey, SVP and General Manager at Xyratex, presents ClusterStor at the Vendor Showdown at ISC13 in Leipzig, Germany.
Join HPCwire Editor Nicole Hemsoth and Dr. David Bader from Georgia Tech as they take center stage on opening night at Atlanta's first Big Data Kick Off Week, filmed in front of a live audience. Nicole and David look at the evolution of HPC, today's big data challenges, discuss real world solutions, and reveal their predictions. Exactly what does the future holds for HPC?