November 14, 2012
LISLE, Ill., Nov. 14 – Molex Incorporated will showcase its proven expertise in high-speed, high-density and high-signal integrity interconnect technology at Super Computing 2012, November 12-15 in Salt Lake City, UT. Company leaders will conduct ongoing product demonstrations in Molex booth 3745.
Molex will have on display the following high-speed interconnect products and solutions:
Molex will demonstrate zQSFP+ stacked thermal management technologies. Wind tunnel testing has been found to offer the most accurate, repeatable test method. Data is generated that will support design of NEBS rated applications with current and next generation pluggable I/O modules.
About Molex Incorporated
Providing more than connectors, Molex delivers complete interconnect solutions for a number of markets including data communications, telecommunications, consumer electronics, industrial, automotive, medical, military and lighting. Established in 1938, the company operates 40 manufacturing locations in 16 countries.
10/30/2013 | Cray, DDN, Mellanox, NetApp, ScaleMP, Supermicro, Xyratex | Creating data is easy… the challenge is getting it to the right place to make use of it. This paper discusses fresh solutions that can directly increase I/O efficiency, and the applications of these solutions to current, and new technology infrastructures.
10/01/2013 | IBM | A new trend is developing in the HPC space that is also affecting enterprise computing productivity with the arrival of “ultra-dense” hyper-scale servers.
Ken Claffey, SVP and General Manager at Xyratex, presents ClusterStor at the Vendor Showdown at ISC13 in Leipzig, Germany.
Join HPCwire Editor Nicole Hemsoth and Dr. David Bader from Georgia Tech as they take center stage on opening night at Atlanta's first Big Data Kick Off Week, filmed in front of a live audience. Nicole and David look at the evolution of HPC, today's big data challenges, discuss real world solutions, and reveal their predictions. Exactly what does the future holds for HPC?