August 29, 2012
Invensas Corporation, a leading provider of semiconductor technology solutions and wholly owned subsidiary of Tessera Technologies, Inc., will demonstrate recent advancements and customer applications in Multi-Die Face-Down (xFDTM) technology at the Intel Developer Forum (IDF), Moscone Center West, San Francisco, Sept. 11-13, 2012.
To be exhibited:
“We are delighted to have the opportunity at IDF to discuss and showcase the pioneering solutions we have been introducing to the server, mobile and personal computing segments over the past few months, and we are excited that OEMs, Original Design Manufacturers (ODMs), and other primary semiconductor supply chain partners are adopting these technologies for future product platforms,” said Simon McElrea, president of Invensas. “We look forward to welcoming current and future partners to our booth at IDF.”
Source: Invensas Corporation
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