November 04, 2009
Nov. 3 -- At SC09, the 22nd annual supercomputing conference, Inphi will launch its Isolation Memory Buffer, the industry's first component based on Inphi's innovative Isolation Memory Buffer (iMB) technology. The iMB memory architecture enables servers to take full advantage of multicore and virtualization technologies. Inphi's iMB component is driving the creation of LR-DIMMs, a new class of memory modules able to deliver upward of four times the memory capacity and nearly double the bandwidth.
Visit Inphi's Booth #1255 to see the first public demonstration of Inphi's Isolation Memory Buffer product (iMB01-GS01). Inphi will show bandwidth-intensive applications running side-by-side on comparably configured systems with and without the Inphi isolation memory buffer.
Sameer Kuppahalli, product marketing manager of the DDR3 Memory Buffer Program at Inphi Corp., will give a technical presentation titled "Meeting the Growing Demands for Memory Capacity and Available Bandwidth in Server and HPC Applications" on Wed., Nov. 18 at 3:30 p.m. in Room E143-144.
Twice a day at SC09, Inphi will hold a drawing to give away an Amazon Kindle device. Attendees can enter the drawing by visiting Inphi's booth.
SC09 will take place Nov. 14-20, 2009. Inphi will be in Booth #1255 at SC09, at the Oregon Convention Center in Portland, Ore.
More information on Inphi's new Isolation Memory Buffer based on iMB technology will be available in the SC09 virtual press room, www.virtualpressoffice.com/kit/InphiSC09.
SC09 will be the 22nd consecutive year of the SC (Supercomputing) Conference Series, the international conference for high-performance computing, networking, storage and analysis. The technical program, which is the heart of this event, has addressed virtually every area of scientific and engineering research, as well as technical development, innovation and education. Established 21 years ago, the SC Conference Series has built a diverse community of participants that include researchers, scientists, computer manufacturing personnel, program managers, journalists and congressional staffers. This diversity is one of the conference's main strengths, making it a yearly "must attend" forum for stakeholders throughout the technical computing community.
Inphi Corporation, a high-speed analog semiconductor company, provides leading-edge interface components that operate at critical interfaces within cloud computing environments, addressing the bandwidth, capacity and power issues faced by datacenters and 40G/100G networks. By leveraging its core competencies in advanced analog circuit design, signal integrity, power management, packaging and process technologies, Inphi has taken a leadership role in the markets it serves. Inphi's more than 150 analog components push the boundaries of existing server, storage and broadband networking applications while paving the way for new ones. To learn more about Inphi, visit www.inphi.com.
Source: Inphi Corp.
10/30/2013 | Cray, DDN, Mellanox, NetApp, ScaleMP, Supermicro, Xyratex | Creating data is easy… the challenge is getting it to the right place to make use of it. This paper discusses fresh solutions that can directly increase I/O efficiency, and the applications of these solutions to current, and new technology infrastructures.
10/01/2013 | IBM | A new trend is developing in the HPC space that is also affecting enterprise computing productivity with the arrival of “ultra-dense” hyper-scale servers.
Ken Claffey, SVP and General Manager at Xyratex, presents ClusterStor at the Vendor Showdown at ISC13 in Leipzig, Germany.
Join HPCwire Editor Nicole Hemsoth and Dr. David Bader from Georgia Tech as they take center stage on opening night at Atlanta's first Big Data Kick Off Week, filmed in front of a live audience. Nicole and David look at the evolution of HPC, today's big data challenges, discuss real world solutions, and reveal their predictions. Exactly what does the future holds for HPC?